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ETAG Co. Products UL

ETAG Co. Products : UL Online Certifications Directory

Certificates

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Jeff Web Pic   etagco-contact-ershadi

Key Specifications/Special Features:

  • Description: 20-layer PCB
  • Min line space (mm): 0.15
  • Min line width (mm): 0.1
  • Min hole diameter (mm): 0.35
  • Thickness (mm): 2.4
  • Type: PTH
  • Base laminate materials: FR-4
  • Board technology: flash gold
  • Solder mask: NANYA (green)
  • Surface plating: NI/AU

 

 

Key Specifications/Special Features:

  • Material: high TG
  • Surface treatment: OSP
  • Width/Space: 4/3.8mil

 

     
etagco-contact-safavi   etagco-contact-tavakol

Key Specifications/Special Features:

  • Description: 24-layer PCB
  • Min line space (mm): 0.1
  • Min line width (mm): 0.095
  • Min hole diameter (mm): 0.2
  • Max board size (mm): 420 x 3.66
  • Thickness (mm): 3.0
  • Type: PTH (SMT)
  • Base laminate materials: high TG FR-4
  • Board technology:HASL
  • Solder mask: NANYA (green)
  • Surface plating: Ni/Au

 

 

Key Specifications/Special Features:

  • Description: 4-layer PCB
  • Min line space (mm): 0.15
  • Min line width (mm): 0.15
  • Min hole diameter (mm): 0.40
  • Max board size (mm): 120 x 50
  • Thickness (mm): 1.2
  • Type: PTH (SMT, DIP)
  • Base laminate materials: halogen free
  • Board technology: immersion gold
  • Solder mask: TAIYO (green)
  • Surface plating: NI/AU

 

     
etagco-contact-safavi   etagco-contact-tavakol

Key Specifications/Special Features:

  • Description: 26-layer PCB
  • Min line space (mm): 0.2
  • Min line width (mm): 0.2
  • Min hole diameter (mm): 0.6
  • Max board size (mm): 459 x 429
  • Thickness (mm): 6.7
  • Type: PTH (SMT, DIP)
  • Base laminate materials: FR-4
  • Board technology: immersion gold + Finger Gold
  • Solder mask: NANYA (green)
  • Surface plating: NI/AU

 

 

Key Specifications/Special Features:

  • Description: 6-layer PCB
  • Min line space (mm): 0.125
  • Min line width (mm): 0.125
  • Min hole diameter (mm): 0.2
  • Max board size (mm): 59.8 x 44.5
  • Thickness (mm): 1.6
  • Type: PTH
  • Base laminate materials: FR-4
  • Board technology: immersion gold
  • Solder mask: NANYA (green)
  • Surface plating: NI/AU

 

     
etagco-contact-safavi   etagco-contact-tavakol

Key Specifications/Special Features:

  • Six-layer
  • Production no: 6E02301SC0
  • Material: FR4+PI
  • Surface treatment: HASL + FINGER GOLD
  • Finish thickness: 1.6mm

 

 

Key Specifications/Special Features:

  • Material: FR4
  • Surface treatment: HASL
  • Width/space: 3.93 and 3
  • Minimum laser drill: 0.15mm
  • Impedance control

 

     
etagco-contact-safavi   etagco-contact-tavakol

Key Specifications/Special Features:

  • Material: FR4
  • Surface treatment: HASL
  • Min drill hole: 0.25mm
  • Blind and buried hole: yes
  • Board thickness: 1.6mm

 

 

Key Specifications/Special Features:

  • Material: FR4
  • Surface treatment: HASL
  • Width/space:3.9/4.2mil.
  • Min. drill hole:0.25mm

 

     
etagco-contact-safavi   etagco-contact-tavakol

Key Specifications/Special Features:

  • Material: FR4
  • Surface treatment: HASL
  • Hole type: counter boring

 

 

Key Specifications/Special Features:

  • Description: 8-layer PCB
  • Min line space (mm): 0.13
  • Min line width (mm): 0.13
  • Min hole diameter (mm): 0. 5
  • Max board size (mm): 285 x 285
  • Thickness (mm): 2.4
  • Type: PTH (SMT)
  • Base laminate materials: FR-4
  • Board technology: HASL
  • Solder mask: TAIYO (green)
  • Surface plating: Sn/Pb

 

     
etagco-contact-safavi   etagco-contact-tavakol

Key Specifications/Special Features:

  • 10-layer high frequency immersion gold board
  • Production number: AS285001A3
  • Material: MCL-BE-67-G (H)
  • Surface treatment: immersion gold + Finger Gold
  • Solder mask: halogen free
  • Minimum laser drill: 0.125mm
  • Impedance control: yes

 

 

Key Specifications/Special Features:

  • Description: 8-layer PCB
  • Min line space (mm): 0.09
  • Min line width (mm): 0.10
  • Min hole diameter (mm): 0.35
  • Max board size (mm): 340 x 321.5
  • Thickness (mm): 2.0
  • Type: PTH (SMT, DIP)
  • Base laminate materials: FR-4
  • Board technology: Electrical Gold
  • Solder mask :Nanya (green)
  • Surface plating: Sn/Pb
  • CAD software (PCB approval): CAM 350 and GENESIS2000

 

     
etagco-contact-safavi   etagco-contact-tavakol

Key Specifications/Special Features:

  • 14-layer board
  • Production number: EW002010A0
  • Material: FR4
  • Surface treatment: Flash Gold
  • Drill hole: 0.20mm
  • Impedance control: yes

 

 

Key Specifications/Special Features:

  • Material: FR4
  • Surface treatment: hard gold (> =0.76um)
  • Width/space: 5/4.5mil
  • Impedance control: 55 ohms +/- 10%
  • Countersinking: yes

 

     
etagco-contact-safavi   etagco-contact-tavakol

Key Specifications/Special Features:

  • Description: 3-layer PCB
  • Min line space (mm): 0.2
  • Min line width (mm): 0.2
  • Min hole diameter (mm): 0.3
  • Max board size (mm): 229 x 196
  • Thickness (mm): 3.0
  • Type: PTH (SMT)
  • Base laminate materials: TACONIC (TLC-32)
  • Board technology: immersion gold
  • Solder mask: NANYA (green)
  • Surface plating: Ni/Au

 

 

Key Specifications/Special Features:

  • Material: RO4350 and RO4003
  • Surface treatment: immersion gold
  • Impedance control: 50 ohms +/- 10%
  • Width/Space: 5.3/3.6mil

 

     
etagco-contact-safavi   etagco-contact-tavakol

Key Specifications/Special Features:

  • Material: nelco N4000-13
  • Width/Space: 4.0/4.0mil
  • Surface treatment: Electrical Gold
  • Min. drill hole: 0.3mm
  • Impedance control: yes

 

 

Key Specifications/Special Features:

  • Material: nelco N4000-13
  • Width/Space: 4.0/4.0mil
  • Surface treatment: HASL
  • Min. drill hole: 0.3mm
  • Impedance control: yes

 

     

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Design by: Electronic Trade of Arsh Gostar Co. (ETAG) Multimedia Studio :: amir abdi :: 2016