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Rigid PCB Manufacture Capabilities(2014.02 Updated)

No.

Items

Capabilities (Deliveryarea<5m2)

Capabilities (Delivery area ≥5m2)

1

Material

Normal FR4

ShengyiS 1141 (Not recommend it to lead free assembly process)

ShengyiS 1141 (Not recommend it to No-PCB assembly process)

2

Normal Tg FR4 ( Halogen free)

ShengyiS 1155

ShengyiS 1155

3

HighTg FR4 ( Halogen free)

ShengyiS 1165

ShengyiS 1165

4

HDI PCB material

LDPP (IT-180A1037&1086)、 Normal PP106&1080

LDPP (IT-180A1037&1086)、 Normal PP106&1080

5

High CTI

ShengyiS 1600

ShengyiS 1600

6

HighTg FR4

FR4 08、 FR4 08HR、 IS410、 FR4 06、 GETEK、 PCL-370HR; IT180A、 IT-150DA; N4000-13、 N4000-13EP、

N4000-13SI、 N4000-13EP SI; Megtron 4、 Megtron6 (Panasonic); EM-827 (Elite); GA-170 (Grace Electron); NP-

180 (Nanya); TU-752、 TU-662 (Taiwan Union); MCL-BE-67G (H)、 MCL-E-679 (W)、 MCL-E-679F (J) (Hitachi); VT-

47 (Ventec)

IT180A、 GETEK、 PCL-370HR、 N4000-13、 N4000-13EP、 N4000-13SI、 N4000-13EP SI

7

Ceramic Particle Filled Laminates

Rogers4350、 Rogers4003、 25FR、 25N

Rogers4350、 Rogers4003、 25FR、 25N

8

PTFE Laminates

Rogers series、 Taconic series、 Arlon series、 Nelco series、 Taizhou Wangling F4BK series、 TP series;

Taconic (TLX、 TLF、 TLY、 RF、 TLC、 TLG series); Arlon (Diclad、 AD series)

9

PTFE PP

TaconicTP series、 TPG series、 TPN series、 HT1.5 (1.5mil)、 Fastrise series

/

10

Hybrid laminating

Rogers/Taconic/Arlon/Nelco laminate with FR-4 material ( including partial Ro4350B hybrid laminating with FR-4)

Rogers/Taconic/Arlon/Nelco laminate with FR-4 material ( including partial Ro4350Bhybrid laminating with FR-4)

11

PCB type

Rigid pcb

Backplane、 HDI、 Highmulti-layer blind & buried PCB、 EmbeddedCapacitance、 Embedded resistanceboard、

Heavy copper power PCB、 Backdrill、 Semiconductor Testproducts.

Backplane、 HDI、 Highmulti-layer blind & buried PCB、 Backdrill

12

Buildings

Blind& buried viatype

mechanical blind &burriedvias with less than3times laminating

mechanical blind &burriedvias with less than 2 times laminating

13

HDI PCB

1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3 (n buried vias≤0.3mm), Laser blind via can be filling plating

1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3 (n buried vias≤0.3mm), Laser blind via can be filling plating

14

Finish treatment

Lead free

Flash gold (electroplated gold)、 ENIG、 Hard gold、 Flash gold、 HASL Lead free、 OSP、 ENEPIG、 Soft gold、

Immersion silver、 Immersion Tin、 ENIG+OSP, ENIG+Gold finger, Flash gold (electroplated gold)+Gold finger, Immersion silver+Gold finger, Immersion Tin+Gold finger

Flash gold (electroplated gold)、 ENIG、 Hard gold、 Flash gold、 HASL Lead free、 OSP、

ENEPIG、 Soft gold、 Immersion silver、 Immersion Tin、 ENIG+OSP, ENIG+Gold finger, Flash gold (electroplated gold)+Gold finger, Immersion silver+Gold finger, Immersion Tin+Gold finger

15

Leaded

Leaded HASL

Leaded HASL

16

aspectratio

10:1 ( HASL Lead free、 HASL Lead、 ENIG、 Immersion Tin、 Immersion silver、 ENEPIG); 8:1 (OSP)

10:1 ( HASL Lead free、 HASL Lead、 ENIG、 Immersion Tin、 Immersion silver、

ENEPIG); 8:1 (OSP)

17

Max finished size

HASL Lead 22"*39"; HASL Lead free22"*24"; Flash gold 24"*24"; Hard gold 24"*28"; ENIG21"*27"; Flash gold (electroplated gold)21"*48"; Immersion Tin16"*21"; Immersion silver16"*18"; OSP24"*40";

HASL Lead 22"*39"; HASL Lead free22"*24"; Flash gold 24"*24"; Hard gold 24"*28"; ENIG

21"*27"; Flash gold (electroplated gold) 21"*48"; Immersion Tin16"*21"; Immersion silver

16"*18"; OSP24"*40";

18

MIN finished size

HASL Lead 5"*6"; HASL Lead free10"*10"; Flash gold 12"*16"; Hard gold 3"*3"; Flash gold (electroplated gold)8"*10"; Immersion Tin2"*4"; Immersion silver2"*4"; OSP2"*2";

HASL Lead 5"*6"; HASL Lead free10"*10"; Flash gold 12"*16"; Hard gold 3"*3"; Flash gold (electroplated gold)8"*10"; Immersion Tin2"*4"; Immersion silver2"*4"; OSP2"*2";

19

PCB thickness

HASL Lead 0.6-4.0mm; HASL Lead free0.6-4.0mm; Flash gold 1.0-3.2mm; Hard gold 0.1-5.0mm; ENIG0.2-

7.0mm; Flash gold (electroplated gold) 0.15-5.0mm; Immersion Tin0.4-5.0mm; Immersion silver0.4-5.0mm;

OSP0.2-6.0mm;

HASL Lead 0.6-4.0mm; HASL Lead free0.6-4.0mm; Flash gold 1.0-3.2mm; Hard gold 0.1-

5.0mm; ENIG0.2-7.0mm; Flash gold (electroplated gold) 0.15-5.0mm; Immersion Tin0.4-

5.0mm; Immersion silver 0.4-5.0mm; OSP0.2-6.0mm;

20

MAX highto gold finger

1.5inch

1.5inch

21

Min space between gold finger s

6mil

8mil

22

Min block space to gold finger s

7.5mil

7.5mil

23

Plating/coatin g thickness

Tin thickness

2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free)

2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free)

24

OSP

0.2-0.6μm

0.2-0.6μm

25

ENIG

Ni:3-8μm; Au:0.05-0.1μm

Ni:3-8μm; Au:0.05-0.1μm

26

Immersion Silver

0.2-0.4μm

0.2-0.4μm

27

Immersion Tin

≥1.0

≥1.0

28

Hard gold

0.1-4.0μm

0.1-2.0μm

29

Soft gold

0.1-4.0μm

0.1-4.0μm

30

ENEPIG

Ni:3-8μm, Pd:0.05-0.15μm, Au:0.05-0.1μm

Ni:3-8μm, Pd:0.05-0.15μm, Au:0.05-0.1μm

31

Flash gold (electroplated gold)

Ni:≥3μm; Au: 0.025-0.1μm; base copper ≤1oz

Ni:≥3μm; Au: 0.025-0.1μm; base copper ≤1oz

32

electroplatedGold finger

Ni:≥3μm; Au: 0.25-1.5μm (TheThinnestpoint)

Ni:≥3μm; Au: 0.25-1.5μm (TheThinnestpoint)

33

Carbon

10-50μm

10-50μm

34

Soldermask

0.4-0.7mil (on copper area), 0.2-0.31mil (on via pad), ≥0.2mil (on circuits around the corner, just for one-time print

and copper thickness <48um)

0.4-0.7mil (on copper area), 0.2-0.31mil (on via pad), ≥0.2mil (on circuits around the corner, just for

one-time print and copper thickness <48um)

35

Blueplastic

8--31.5mil

8--16mil

36

hole

MAX thickness of mechanical hole

4mil/6mil/8mil

31.5mil/59mil/100mil

24mil/47mil/63mil

37

Min laser drilling size

4mil

4mil

38

Max laser drilling size

6mil

6mil

39

Finshed mechanical hole size

4-244mil (corresponding drilling tool size6-248mil)

5-244mil (corresponding drilling tool size8-248mil)

40

A、 Min finished hole size for PTFE material and hybrid PCB is10mil (corresponding drilling tool size14mil)

A、 Min finished hole size for PTFE material and hybrid PCB is12mil (corresponding drilling tool

size16mil)

41

B、 Max finished hole size for blind & buried viais 12mil (corresponding drilling tool size16mil)

B、 Max finished hole size for blind & buried viais 12mil (corresponding drilling tool size16mil)

42

C、 Max finished hole size for via-in-padpluged with soldermask is18mil (corresponding drilling tool size21.65mil

C、 Max finished hole size for via-in-padpluged with solder maskis12mil (corresponding drilling

)

tool size16mil)

43

D、 Min connecting hole sizeis14mil (corresponding drilling tool sizeis18mil)

D、 Min connecting hole sizeis14mil (corresponding drilling tool sizeis18mil)

44

E、 Min half- hole (pth) sizeis12mil (corresponding drilling tool sizeis16mil)

E、 Min half- hole (pth) sizeis12mil (corresponding drilling tool sizeis16mil)

45

MAX aspectratio for Holeplate

20:1 ( holediameter>8mil)

10:1

46

Max aspectratio for laser via filling plating

1:1 (Dpethincluded copper thickness)

0.9:1 (Dpethincluded copper thickness)

47

Max aspectratio for mechanical depth-controldrillingboard (Blind hole drilling depth/blind hole size)

1.3:1 (drilling tool size≤8mil), 1.15:1 (drilling tool size≥10mil)

0.8:1 (drilling tool size≥10mil)

48

Min depth of Mechanical depth-control (backdrill)

8mil

8mil

49

Min gap between hole wall and

conductor (None blind and buried via

PCB)

5.5mil (≤8L), 6.5mil (10-14L), 7mil (>14L)

7mil (≤8L), 9mil (10-14L), 10mil (>14L)

50

Min gap between hole wall conductor

(Blind and buried via PCB)

7mil (1time laminating), 8mil (2times laminating), 9mil (3times laminating)

8mil (1times laminating), 10mil (2times laminating), 12mil (3times laminating)

51

Min gab between hole wall conductor

(Laser blind hole buried via PCB)

7mil (1+N+1); 8mil (1+1+N+1+1 or2+N+2)

7mil (1+N+1); 8mil (1+1+N+1+1 or2+N+2)

52

Min space between laser holes and conductor

5mil

6mil

53

Min space bwteen hole walls in different net

10mil

10mil

54

Min space bwteen hole walls in same net

6mil (thru- hole&laser hole PCB), 10mil ( Mechanical blind & buried PCB)

6mil (thru- hole&laser hole PCB), 10mil ( Mechanical blind & buried PCB)

55

Min space bwteen NPTH hole walls

8mil

8mil

56

Holelocation tolerance

±2mil

±2mil

57

NPTH tolerance

±2mil

±2mil

58

Pressfit holes tolerance

±2mil

±2mil

59

Countersink depth tolerance

±6mil

±6mil

60

Countersink hole size tolerance

±6mil

±6mil

61

Pad (ring)

Min Pad size for laser drillings

10mil (for 4millaser via), 11mil (for 5millaser via

10mil (for 4millaser via), 11mil (for 5millaser via

62

Min Pad size for mechanical drilling

16mil (8mildrillings)

16mil (8mildrillings

63

Min BGApad size

HASL :10mil, LF HASL :12mil, other surface technics are7mi

HASL :10mil, LF HASL :12mil, other surface technics are 10mil (7milisok for flash gold

64

Pad size tolerance (BGA)

±1.2mil (pad size≤12mil); ±10% (pad size≥12mil)

±1.5mil (pad size≤10mil); ±15% (pad size>10mil)

65

 

internal Layer

1/2OZ:3/3mil

1/2OZ:3/3mil

66

1OZ: 3/4mil

1OZ: 3/4mil

67

2OZ: 4/5mil

2OZ: 4/5.5mil

68

3OZ: 5/8mil

3OZ: 5/8mil

69

4OZ: 6/11mil

4OZ: 6/11mil

70

5OZ: 7/13.5mil

5OZ: 7/14mil

71

6OZ: 8/15mil

6OZ: 8/16mil

72

7OZ: 9/18mil

7OZ: 9/19mil

73

8OZ: 10/21mil

8OZ: 10/22mil

74

9OZ: 11/24mil

9OZ: 11/25mil

75

10OZ:12/27mil

10OZ: 12/28mil

76

Width/Space

external Layer

1/3OZ:3/3mil

1/3OZ:3.5/4mil

77

1/2OZ:3.5/3.5mil

1/2OZ:3.9/4.5mil

78

1OZ: 4.5/5mil

1OZ: 4.8/5.5mil

79

1.43OZ (positive):4.5/6

1.43OZ (positive):4.5/7

80

1.43OZ (negative):5/7

1.43OZ (negative):5/8

81

2OZ: 6/7mil

2OZ: 6/8mil

82

3OZ: 6/10mil

3OZ: 6/12mil

83

4OZ: 7.5/13mil

4OZ: 7.5/15mil

84

5OZ: 9/16mil

5OZ: 9/18mil

85

6OZ: 10/19mil

6OZ: 10/21mil

86

7OZ: 11/22mil

7OZ: 11/25mil

87

8OZ: 12/26mil

8OZ: 12/29mil

88

9OZ: 13/30mil

9OZ: 13/33mil

89

10OZ:14/35mil

10OZ:14/38mil

90

Width tolerance

≤10mil:+/-1.0mil

≤10mil:+/-20%

91

>10mil:+/-1.5mil

>10mil:+/-20%

92

Soldermask

MAX drilling tool size for via filled with Soldermask (singleside)

35.4mil

35.4mil

93

Soldermask color

Greenmatte/glossy, Yellow, Black, Blue, Red, White, Purple

Greenmatte/glossy, Yellow, Black, Blue, Red, White, Purple

94

Silkscreencolor

White, Yellow, Black

White, Yellow, Black

95

MAX hole size for via filled with Blue glue aluminium

197mil

197mil

96

Finish hole size for via filled with resin

4-25.4mil

4-25.4mil

97

Max aspectratio for via filled with resin board

12:1

8:1

98

Min width of soldermask bridge

Base copper ≤0.5oz、 Immersion Tin:7.5mil (Black), 5.5mil (O the rcolor), 8mil (on copper area)

Base copper ≤0.5oz、 Immersion Tin:7.5mil (Black), 5.5mil (O the rcolor), 8mil (on copper area)

99

Base copper ≤0.5oz、 Finish treatment not Immersion Tin:5.5mil (Black, extremity5mil), 4mil (O the r

color, extremity3.5mil), 8mil (on copper area)

Base copper ≤0.5oz、 Finish treatment not Immersion Tin:5.5mil (Black, extremity5mil),

4mil (O the rcolor, extremity3.5mil), 8mil (on copper area

100

Base copper 1oz:4mil (Green), 5mil (O the rcolor), 5.5mil (Black, extremity5mil), 8mil (on copper area)

Base copper 1oz:4mil (Green), 5mil (O the rcolor), 5.5mil (Black, extremity5mil), 8mil (on copper area)

101

Base copper 1.43oz:4mil (Green), 5.5mil (O the rcolor), 6mil (Black), 8mil (on copper area)

Base copper 1.43oz:4mil (Green), 5.5mil (O the rcolor), 6mil (Black), 8mil (on copper area

102

Base copper 2oz-4oz:6mil, 8mil (on copper area)

Base copper 2oz-4oz:6mil, 8mil (on copper area)

103

Routing

Min space of the v-cut does not

reveal the copper (Central Line of v-cut to internal/external circuits, Hmeans board thickness)

H≤40mil:12mil (20°mean v-cut angle), 13mil (30°), 14.6mil (45°

H≤40mil:12mil (20°mean v-cut angle), 13mil (30°), 14.6mil (45°

104

40<H≤63mil: 14.2mil (20°), 16mil (30°), 20mil (45°

40<H≤63mil: 14.2mil (20°), 16mil (30°), 20mil (45°

105

63<H≤94.5mil:16.5mil (20°), 20mil (30°), 25.2mil (45°

63<H≤94.5mil:16.5mil (20°), 20mil (30°), 25.2mil (45°

106

94.5<H≤118.1mil:18.5mil (20°), 23.2mil (30°), 30.3 (45°

94.5<H≤118.1mil:18.5mil (20°), 23.2mil (30°), 30.3 (45°

107

v-cut symmetrical tolerance

±4mil

±4mil

108

MAX v-cut lines

100

100

109

v-cut angle tolerance

±5°

±5°

110

v-cut angle

20、 30、 45°

20、 30、 45°

111

Gold finger bevelling

20、 30、 45、 60°

20、 30、 45、 60°

112

Gold finger bevelling tolerance

±5°

±5°

113

Min space of gold finger chamfering noninterference tab

236mil

275.6mil

114

Min gap between the sideof

gold finger and the shape edgeline

8mil

10mil

115

Depth tolerance of depth-control groove milling

±4mil

±4mil

116

routing tolerance (edge toedge)

±4mil

±4mil

117

Min tolerance for routing slot (PTH)

width/length tolerance ±5mil

width/length tolerance ±5mil

118

Min tolerance for routing slot

(NPTH)

width/length tolerance ±4mil

width/length tolerance ±4mil

119

Min tolerance for drilling slot (PTH)

width tolerance ±3mil; Length/ width ≥2, length tolerance ±3mil; Length/ width <2, length tolerance ±4mil

width tolerance ±3mil; Length/ width ≥2, length tolerance ±3mil; Length/ width <2, length tolerance ±4mil

120

Min tolerance for drilling slot

(NPTH)

width tolerance ±2mil; Length/ width ≥2, length tolerance is±2mil; Length/ width <2, width and length tolerance ±

3mil

width tolerance ±2mil; Length/ width ≥2, length tolerance is±2mil; Length/ width <2, width and

length tolerance ±3mi

121

Local mixed pressure

Min gap between mechanical hole wall and conductor (Local mixed pressure area)

12mil ( local 10mil)

12mil ( local 10mil)

122

Min gap between mechanical hole wall and the junction of local mixed pressure

10mil

10mil

123

Metal-substrate PCB

Layer counts

1-8L (Al-substrate、 Cu-substrate); 2-24L (Heatsink、 Sweat bonding、 Buried metal); 1-2L (Ceramic-substrate)

1-8L (Al-substrate、 Cu-substrate); 2-24L (Heatsink、 Sweat bonding、 Buried metal); 1-2L (Ceramic-

substrate)

124

PCB size (Finished)

Max :24"*24", Min : 0.2"*0.2" (Al-substrate、 Cu-substrate、 Heatsink、 Sweat bonding、 Buried metal)

Max :24"*24", Min :0.2"*0.2" (Al-substrate、 Cu-substrate、 Heatsink、 Sweat bonding、 Buried metal)

125

MAX PCB size (Ceramic-substrate

PCB)

4"*4"

4"*4"

126

PCB thickness (Finished)

0.02"-0.2"

0.02"-0.2"

127

Copper thickness (Finished)

0.5-10oz

0.5-10oz

128

Metal thickness

0.02"-0.2"

0.02"-0.2"

129

Metal material type

AL:1100/1050/2124/5052/6061; Cu:c11000; Iron

AL:1100/1050/2124/5052/6061; Cu:c11000; Iron

130

Min finished hole size& tolerance

NPTH:20±2mil; PTH:40±4mil (for Al-substrate、 Cu-substrate)、 8±4mil (for Heatsink、 Sweat bonding、 Buried metal)

NPTH:20±2mil; PTH:40±4mil (for Al-substrate、 Cu-substrate)、 8±4mil (for Heatsink、 Sweat bonding、 Buried metal)

131

Dimension tolerance

±1.2mil

±2mil

132

PCB partial surface treatment

Leaded HASL/Lead free HASL; OSP; ENIG; ENEPIG; Plating (Ni)Soft/Hard gold; PlatingSn

Leaded HASL/Lead free HASL; OSP; ENIG; ENEPIG; Plating (Ni)Soft/Hard gold; PlatingSn

133

Metal partial surface treatment

Cu:PlatingNi&Au; Al:Anodic oxidation、 Hard anodic oxidation coating、 Chemical passivation; Physical

treatment :S and blasting、 Wiredrawing

Cu:PlatingNi&Au; Al:Anodic oxidation、 Hard anodic oxidation coating、 Chemical passivation;

Physical treatment :S and blasting、 Wiredrawing

134

Material

Metal PCB :Totking (T-110、 T-111)、 Ventec (VT-4A1、 VT-4A2、 VT-4A3)、 Laird (1KA04、

1KA06); Bergquist (MP06503、 HT04503)、 TACONIC (TLY-5、 TLY-5F)

Metal PCB :Totking (T-110、 T-111)、 Ventec (VT-4A1、 VT-4A2、 VT-4A3)、 Laird (1KA04、

1KA06); Bergquist (MP06503、 HT04503)、 TACONIC (TLY-5、 TLY-5F)

135

Thermal glue thickness (dielectric layer)

3-6mil

3-6mil

136

Buried copper block size

0.118"*0.118"--2.756"*3.15"

0.118"*0.118"--2.756"*3.15"

137

Buried copper block drop tolerance

±1.6mil

±1.6mil

138

Min gap between Buried copper block and hole wall

12mil

12mil

139

Thermal conductivity

0.3-3w/m.k (Heatsink、 Al-substrate、 Cu-substrate); 8.33w/m.k (Sweat bonding); 0.35-3w/m.k ( Buried metal); 24-180

w/m.k (Ceramic-substrate)

0.3-3w/m.k (Heatsink、 Al-substrate、 Cu-substrate); 8.33w/m.k (Sweat bonding); 0.35-3w/m.k ( Buried

metal); 24-180w/m.k (Ceramic-substrate)

140

Others

Max finished copper thickness to internal & external layer

internal layer :10oz; external layer :11oz

internal layer :4oz; external layer :5oz

141

finished copper thickness to external layer

base copper 1/3oz、 0.5oz:≥35.8μm (reference value:35.8-42.5μm ); ≥40.4μm (reference value:40.4-

48.5μm )

base copper 1/3oz、 0.5oz:≥35.8μm (reference value:35.8-42.5μm ); ≥40.4μm (reference

value:40.4-48.5μm )

142

base copper 1oz、 1.43oz、 2oz:≥55.9μm ; ≥70μm ; ≥86.7μm

base copper 1oz、 1.43oz、 2oz:≥55.9μm ; ≥70μm ; ≥86.7μm

143

base copper 3oz、 4oz:≥117.6μm ; ≥148.5μm

base copper 3oz、 4oz:≥117.6μm ; ≥148.5μm

144

Layercount

1-40L

1-20L

145

PCB thickness

8-275.6mil (No Soldermask); 15.7-275.6mil (Have Soldermask)

11.8-196.85mil (No Soldermask); 15.7-196.85mil (Have Soldermask)

146

PCB thickness tolerance ( Normal

Thickness>40mil:±10%; Thickness≤40mil:±4mil

Thickness>40mil:±10%; Thickness≤40mil:±4mil

147

PCB thickness tolerance (Special)

Thickness≤80mil:±4mil; 80mil<Thickness≤120mil: ±6mil

Thickness≤80mil:±10%; 80mil<Thickness≤120mil: ±6mil

148

Min finished PCB size

0.4"*0.4"

2.0"*4.0"

149

Max finished PCB size

23×35inch (2L); 22.5*33.5inch (4L); 22.5*30inch (≥6L)

20×30inch (2L); 22.5*30inch (4L); 16.5*22.5inch (≥6L)

150

ionicsoil

≤1ug/cm2

≤1ug/cm2

151

Min bow&twist

0.1% (This ability request same laminated plate type, symmetry laminated construction, the difference of symmetry

layer Copper area with in10%, uniformity wiring, excluding the largearea of copper and base material, haven'tplate and single panel, and the longside size≤21inch)

0.75%

152

Impedance tolerance

±5ohm (<50ohm), ±10% (≥50ohm)

±5ohm (<50ohm), ±10% (≥50ohm)

153

Laser blind via size with filling plating

4-5mil (priority4mil)

4-5mil (priority4mil)

154

Max aspectratio for laser via filling plating

1:1 (Depth included copper thickness)

1:1 (Depth included copper thickness)

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