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HDI Board General Information

High Density Interconnects (HDI) board is another kind of  board (PCB) . They have finer lines and spaces (<100 µm), smaller vias (<150 µm) and capture pads (<400 µm), I/O>300,  than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance.

According to layer up different, currently DHI board is divided into 2 basic types:

1) HDI PCB (1+N+1)

Features:

  • Suitable for BGA with lower I/O counts
  • Qualified material and surface treatment for Lead-free process
  • Excellent mounting stability and reliability
  • Copper filled via

Application: Cell phone, UMPC, MP3 Player, PMP, GPS, Memory Card

1+N+1 HDI PCB Structure:

 HDI-PCB-1

HDI-PCB-2 

2) HDI PCB (2+N+2)

Features:

  • Suitable for BGA with  higher I/O counts
  • Increase routing density in complicated design
  • Thin board capabilities
  • Lower Dk / Df material enables better signal transmission performance
  • Copper filled via

Application: Cell phone, PDA, UMPC, Portable game console, DSC

 HDI-PCB-3

HDI-PCB-4 

 

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Design by: Electronic Trade of Arsh Gostar Co. (ETAG) Multimedia Studio :: amir abdi :: 2016