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 MIL-PRF-31032 Certified!
Also AS9100C and MIL SPEC 55110 Certified!

 

What is ISO?

ISO 9001-2008 belongs to a family of standards for quality management systems maintained by the International Organization for Standardization. It is administered by accreditation and certification bodies worldwide. The scope of the standard includes requirements for the quality management system to demonstrate its ability to consistently provide product that meets customer requirements and enhances customer satisfaction through the application of the quality management system. The standard prescribes formal documentation of procedures, performance measurement and continual improvement to assure conformity to customer and regulatory requirements through the use of corrective action, inspection and testing, monitoring and review.

IPC-A-600 PCB Inspection Guidelines

In an effort to insure quality for our customers, ETAG has adopted an inspection program using the IPC-A-600 Rev F as its guide. This industry specification is the pictorial guide for the acceptability of printed circuit boards.

IPC-A-600 and IPC-6012 Inspection Items

The following chart shows the IPC-A-600F (or its supporting document IPC-6012) inspection item and its call-outs. The ETAG inspection column gives the ETAG method of compliance.

IPC (Institute of Interconnecting and Packaging Electronic Circuits) publishes the IPC-A-600 Rev F pictorial guide.

Notes for IPC PCB Inspection Standards

*** Please note that the asterisk items are not rejectable if design review plus is not selected.

* We seek to use the standard's classification and defect determinations to maintain a "Class II" quality level. We have elected to use an adapted inspection system to maintain production quality. Our quality program, sampling plans, coupon use, record keeping, and use of outside labs is different than the IPC-6012.

Characteristic

IPC-600F Guideline *

ETAG Inspection

Board edges

  • Haloing and nicks maximum .100" or 50% of distance to nearest conductor, whichever is less.
  • Final inspection

Bow and twist

  • General 1.5% max.
  • SMT boards 0.75%. max.
  • Final inspection

Conductor thickness

  • Table 3-9 (external)
  • Table 3-8 (internal)
  • Measurement made at post etch inspection
  • Measurement made at post etch inspection

Copper plating thickness, minimum in holes

  • Class 2, avg. .0008" , thin spots .0007"
  • Class 3, avg. .001", thin spots .0008" (Table 3-2)
  • Sample of holes measured by PTX to determine average plated hole thickness.

Copper plating voids

  • Class 2 - One Cu void allowed per hole in not more than 5% of the holes.
  • Class 3 - No Cu voids allowed.
  • Shall not exceed 5% of hole length or 90° of circumference (Table 3-3)
  • 100% visual inspection after etching· cross section referee
  • 100% visual inspection after etching· cross section referee

Delamination/blisters

  • Evaluated in accordance with IPC-A-600
  • Class 1 now same as Class 2, 3 (2.3.3)
  • Evidence of delamination in micro section now refers to 2.3.3 instead of being automatically nonconforming (3.1.4)
  • Post-final surface finish inspection / final inspection

Solder Dewetting

  • Ground planes and traces: allowed
  • Solder connection areas: max. 5% (Class 2, 3)
  • Post-final surface finish inspection / final inspection

Finish plating voids

  • Class 2 - Three solder voids allowed per hole in not more than 5% of the holes.
  • Class 3 - One solder void per hole in not more than 5% of the holes.
  • Shall not exceed 5% of hole length or 90° of circumference (Table 3-3)
  • Post-final surface finish inspection / final inspection

Foreign inclusions

  • Evaluated in accordance with IPC-A-600, except no maximum dimension specified (3.3.2.1)
  • Post-final surface finish inspection

Gold thickness

  • Class 2 - min. 30µ"· Class 3 - min. 50µ"· Solderable gold - 30µ" maximum.
  • Beta-backscatter or XRF measurement on sample after gold plating

Hole location

  • As specified on procurement document.
  • In-process visual inspection (after etching, before mask)

Hole sizes

  • ±.004" for plated through holes, ±.003 for non-plated through holes, +.003 / - hole size for vias, unless otherwise specified by customer
  • Hole sizes not verified for Express product. All other product lines: plug gauge measurements made.

Solder Mask coverage

  • See 3.8.1
  • Post-final surface finish inspection

Solder Mask cure & adhesion

  • No tackiness
  • Blisters/delamination: 2 per side, max. .010 in, does not reduce spacing by more than 25%
  • Soda-strawing is now defined as applying to DFSM only (2.9.9)
  • Post-final surface finish inspection

Solder Mask in holes

  • Allowed only in holes in which are not to be soldered.
  • Post-final surface finish inspection

Solder Mask registration

 

  • Post-final surface finish inspection

Solder Mask thickness

  • Visual coverage; no thickness requirement
  • Not checked unless specifically required by drawing

Solder Mask touch-up

  • Touch-up material specified (IPC-A-600F 2.9.1)
  • Post-final surface finish inspection

Measles/crazing

  • Evaluated in accordance with IPC-A-600
  • Measles acceptable for all except high voltage applications [not defined] (2.3.1)
  • Crazing spec. now same as delamination except 50% of distance between conductors may be spanned; also now shows pictures of crazing (2.3.2)
  • In-process inspection (after etch, before solder mask)

Min. ann. ring NPTH

  • Class 2: No breakout allowed.
  • Final inspection ***

Min. ann. ring-internal

  • Class 2: 90° breakout allowed
  • Process control using etched drill panel (selecting the design review option ensures design is within capability). ***

Min. external ann. ring - PTH

  • Class 2: 90° breakout allowed except at junction of pad and trace, where .002" minimum is allowed.
  • In-process inspection (after etch, before mask). Selecting the design check option ensures design is within capability. ***

Nomenclature (silkscreen)

  • Refers to IPC-A-600 for legibility requirements Marking ink on surface mount lands no longer nonconforming (IPC-A-600F 2.8.3)
  • Final inspection ***

Nonwetting

  • None allowed
  • Post-final surface finish inspection

Pink ring

  • Acceptable (3.3.2.6)
  •  

Pits and voids in base material

  • Acceptable if no larger than 0.8 mm [.03 in] and no more than 5% of board area
  • Post-final surface finish inspection

Plating adhesion

  • Tape test required (slivers coming off with tape is not cause for rejection)
  • In-process inspection (after etch, before mask)

Plating cracks

  • See Table 3-7 (basically none allowed)
  • In-process visual inspection (after etch, before mask) cross section referee

Resin fill of blind/buried vias

  • Buried vias shall be at least 60% filled with resin (3.3.14)
  • Not applicable

Routing tolerances

  • As specified on procurement document.
  • Final inspection; sample checked per customer drawing or default to ±.010

Spacing reduction

  • When not specified on the customer's documentation, 30% allowed for class 2; 20% allowed for class 3.
  • In-process measurement / inspection (after etch, before mask)***

Tenting (via holes)

 

  • Post-final surface finish inspection (when required) ***

Tin/lead, solder coat

  • Unfused tin/lead: min. thickness .0003"
  • Fused or HAL: coverage and solderable.
  • Sidewalls do not have to be covered.
  • Post-final surface finish inspection

Trace width

  • Class 2, 3: When not specified on the customer's documentation, 20% max. line loss, additional 20% for isolated defects
  • In-process measurement / inspection (after etch, before mask)***

Weave exposure and exposed/disrupted fibers

  • Acceptable for Class 1, 2, 3 as long as minimum conductor spacing is met.
  • In-process inspection (after etch, before mask)

Weave texture

  • Not addressed
  • Not applicable

Documentation Retention

  • Evidence of Inspection and / or Testing
  • Express Product 90 Days
  • PCB123 Product 90 Days
  • Full-Feature Product 3 Years

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Design by: Electronic Trade of Arsh Gostar Co. (ETAG) Multimedia Studio :: amir abdi :: 2016