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Improve your PCB Solderability

After manufacturing, two common causes of solderability problems are long storage period and poor storage condition. Many companies try to lower per board cost by ordering in volume. The stockpile may keep boards on the shelf too long. The humidity, exposure to air and temperature cause oxidization to PCB boards. Board oxidation dooms the assembly process before solder even touches the PCB pad.

 we provide low-cost just-in-time manufacturing to help you manage the shelf-life of your boards. We also pay particular attention to PCB solderability during the manufacturing process of resist residue cleaning, tinning and packaging.

small quantity vacuum bubble wrapped PCB 150x150 Improve your PCB Solderability

Finished PCB vacuum packed with bubble wraps and silica gel

large quantity vacuum bubble wrapped PCB 150x150 Improve your PCB Solderability

Finished PCB vacuum packed with bubble wraps and silica gel

Taking packaging as example, all finished boards are vacuum packed with bubble wraps and silica gel to reduce board’s exposure to air and humidity. This effectively prevents oxidization and surface scratches during transportation. The following are two images of finished PCB boards manufactured

 

Printed Circuit Board Reliability Test

ETAG manufactured circuit boards go through a sereis of extensive tests and inspections at each step of the manufacturing process to assure the products we ship meets or exceed your specifications. Below are some of our circuit board test methods.

Printed Circuit Board Lamination
Test Item Test Method/Equipment Criteria Capability
Glass Transition

Temperature

D.S.C
T.M.A
D.M.A
FR- 4 Tetra>130°(D.S.C)
FR- 4 NP170>175°(D.M.A)
FR- 406>165°(D.S.C)
>132°
>176°
>168°
Peel Strength IPC-TM-650 Trace to Laminate>9 lb/in (Normal Tg Material)
Trace to Laminate 6 lb/in (High Tg Material)
Layer to Layer>4 lb/in
>10 lb
>6 lb
>6 lb

 

Printed Circuit Board Copper Plating
Test Item Test Method/Equipment Criteria Capability
Elongation Test TPC-TM-650 >6% >10%
Tensile Strength TPC-TM-650 >25kg/mm >30kgf

 

Printed Circuit Board Solderability
Test Item Test Method/Equipment Criteria Capability
PTH


SMD / BGA Pad

1. Solder Pot Floating:
245°,4sec

2. Wetting Balance

No Dewetting Pass

 

Printed Circuit Board Hole Wall Quality
Test Item Test Method/Equipment Criteria Capability
Temperature


Cycling

125°,15Min


-55°,15Min

1. Hole Wall Resistance <20%
change after 1000 cycles

2. Hole Wall Quality

1. <20


2. No Crack

Thermal


Shock

125°,5min


-55°,5min

1. Hole Wall Resistance<10%
change after 100 cycle

2. Hole wall Quality

1. <10%


2. No Crack

Thermal Stress 288°,10sec,
Solder Float
No Delamination
No Hole Wall Detect
Pass

 

Electrical
Test Item Test Method/Equipment Criteria Capability
High Pot. Test 1000 Volts,1minute <1mA Leakage Pass

 

Environment
Test Item Test Method/Equipment Criteria Capability
Water Absorption
Test (for BGA)
120°,2hrs,after 24hrs Wright Increase <0.24%
after 24hrs test
<0.2%

 

Cleanliness
Test Item Test Method/Equipment Criteria Capability
Surface

Insulation

Resistance

Pre Condition:23°,
50% RH,3hr

Test Condition:35°,
85% RH,24hr

Insulation Resistance
After Black Oxide>10G Ω
After O/L Etch>10G Ω
After HASL>3G Ω
>10G Ω
>10G Ω
>4G Ω
Solvent

Extract

Conductivity

Omega Meter 600
SMD 15min

Omega Meter 500
SMD 15min (for BGA)

After Black Oxide,
O/L Etch, Finish Board

1. <6.4ugNacl/in²

2. <2.4ugNacl/in²
(for BGA substrate)

1. Avg:<4

2. Avg:<2.0

High Humidity 50°,95%/RH,
7days,100V Bias
Resistance>1G Ω Pass
I.C.T I.C.T 1. CI‾ <3ug/in²
2. Br‾ <3ug/in²
3. SO4²- <10ug/in²
1. Avg:<2.8
2. Avg:<2
3. Avg:<8

 

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Design by: Electronic Trade of Arsh Gostar Co. (ETAG) Multimedia Studio :: amir abdi :: 2016