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Rigid-Flex PCB



Rigid-Flex-RigidFlex-boards-001

Delivery Time

Configuration

Delivery time

Flexible

 Rigid-Flexible

Single layer

Multilayer 

Unclad

 Normal

Blind-buried

Special

Unclad 

Standard

 5

10 

 7

12

15 

12 

 The quickest

 2

3

3

 3

5

7

7

Flex & Rigid-Flex Circuits

Flex & Rigid-Flex circuits can be shaped to fit where no other design can. They are a hybrid of ordinary printed circuit boards and round wire, exhibiting benefits of each. In essence, flexible circuits give you unlimited freedom of packaging geometry while retaining the precision density and repeatability of printed circuits.

As a high reliability replacement for wire and wire harness assemblies, flex circuits provide a significant cost savings with no reduction in performance.

There are a variety of terminations for flex circuits and we can provide all of these as standard manufacturing process. Adding connectors and other minor component assembly is a common practice when producing flex and rigid flex circuits.

Flex & Rigid-Flex Circuits Glossary

Access Hole:
A hole in a layer of dielectric material that provides access to a land on a conductive layer of the flexible circuit.

Adhesions (pressure sensitive tape):
The bond produced by contact between pressure-sensitive adhesive and a surface.

Adhesive:
A substance such as glue or cement used to fasten objects together.

Array:
A group of elements or circuits arranged in rows and columns on a panel.

Artwork:
An accurately-scaled configuration that is used to produce the conductor pattern.

Base Material:
The insulative material upon which a conductive pattern may be formed. The base material may be rigid or flexible, or both.

Bend Ratio:
A relationship between the thickness of material bent to the radius over which it is bent.

Bending Resistance:
The ability of a material to withstand repeated bending to specified parameters without producing cracks or breaks in excess of the specification allowance.

Bonding Layer:
An adhesive layer used in bonding together plies of dielectric and conductive materials during lamination.

Cap Lamination:
A process of making multilayer printed boards with surface layers of metal-clad laminates bonded in a single operation.

Conductor Layer:
The total conductive pattern formed on one side of a single layer of base material.

Coverfilm (Coverlayer):
A film of dielectric material with adhesive which is bonded over the etched conductor runs to insulate them.

Dielectric Strength:
The maximum voltage that a dielectric can withstand under specified conditions without resulting in a voltage breakdown, usually expressed as volts per unit of dimension.

Dynamic Flex:
A flexible circuit designed to move during operation.

Edge Spacing:
The distance of an etched feature from the edges of a printed board.

Flexible Multilayer Printed Board (Type 3):
Multilayered printed board made of only flexible materials. Different areas of the multilayer printed board may have different numbers of layers and thickness.

Flexible Printed Board (Circuit):
A printed board made only of flexible materials.

Insulation Resistance:
The electrical resistance of an insulting material that is determined under specific conditions between any pair of contacts, conductors or grounding devices in various combinations.

Polyimide:
The synthetic polymer that has more than two imide radicals in the main chain.

Prepreg:
A sheet of material that has been impregnated with a resin cured to an intermediate stage (i.e. B-staged resin).

Sequential Lamination:
The process of manufacturing multilayer printed circuit boards in which multiple double-sided layer stacks with interconnecting holes between conductive patterns on both sides are laminated or combined, after which additional layers are attached to the partially completed board stack up.

Static Flex (Flex-To-Install):
A flexible printed board designed to be bent for installation purposes only (not in operation).

Steel Rule Die:
A piece of tooling made from a hardwood base with hand-formed steel rule placed into a laser burned path which is used to profile portions of or the entire final shape of a flex circuit.

Stiffener Board:
A material fastened to the surface of a flexible printed board to increase its mechanical strength.

Thermal Cure:
A chemical reaction using heat energy that hardens organic substances such as adhesives and coating materials.

Window (in the coverlayer):
An opening in the dielectric of a flexible printed board that exposes conductors.

Types of Flex Circuits

Each type of flex circuit offers different advantages. While some types of flex circuits can offer lower production costs, others have additional increased functionality.Rigid-Flex-RigidFlex-boards-002

We provide early design services for all your Flex and Rigid-Flex needs. From selecting the best functional configuration to choosing the proper connectors or components, we will help you with your product from early design stages to production.

hypes of Flex Circuits

Single-Layer Flex Circuit

  • IPC 6013 - Type 1
  • One conductive layer, either bonded between two insulating layers or uncovered on one side.
  • Stiffeners, pins, connectors, components, are optional.

Rigid-Flex-RigidFlex-boards-003

Double-Sided Flex Circuit

  • IPC 6013, - Type 2
  • Two conductive layers with an insulating layer between; outer layers may have covers or exposed pads.
  • Plated through-holes provide connection between layers.
  • Stiffeners, pins, connectors, components are optional.

Rigid-Flex-RigidFlex-boards-004

Multi-Layer Flex Circuit

  • IPC 6013 - Type 3
  • Three or more flexible conductive layers with flexible insulating layers between each one; outer layers may have covers or exposed pads.
  • Plated through-holes provide connection between layers.
  • Controlled impedance possible.

Rigid-Flex-RigidFlex-boards-005

Rigid-Flex Circuit

  • IPC 6013 - Type 4
  • Two or more conductive layers with either flexible or rigid insulation material as insulators between each one; outer layers may have covers or exposed pads.
  • Rigid-flex has conductors on the rigid layers, which differentiates it from multi-layer circuits with stiffeners. Plated through-holes extend through both rigid and flexible layers (with the exception of blind and buried vias). Rigid-flex costs more than a standard circuit with stiffeners.

Rigid-Flex-RigidFlex-boards-006

Rigid-Flex Circuit Benefits

Rigid-Flex-RigidFlex-boards-007

Rigid Flex circuits gives the ability to design your circuitry to fit the device, instead of building a device to fit th

e circuit board.

Rigid Flex circuits are designed for the rigors of aerospace, medical and military applications, with dependable reliability. Flex assemblies have the ability to be folded or creased and positioned into the smallest areas makes miniaturization of many devices possible, while offering a substantial weight reduction

 

 

Flex Circuit Benefits

Package Size Reduction

  • Flexible circuit thinness and light weight will enable a substantial packaging size reduction.
  • Flexible circuit's ability to be folded or creased and positioned into the smallest areas makes miniaturization of many devices possible.

Cost Reduction

  • Thin and flexible polyimide film requires a much smaller area, reducing the packaging size and overall material costs.
  • Flex circuits used as interconnects reduce the number of connections to be soldered.

Replacement for Wires & Wire Harness Assemblies

  • Flexible circuits used to replace wiring reduces the errors common in hand wired assemblies.

High Temperature Applications

  • Flex circuits dissipate heat at a better rate than other dielectric materials.
  • Expansion and contraction are minimized when using polyimide material.

Weight Reduction

  • Substantial weight reduction is a benefit over wires and wire harnesses.

High Density Applications

  • Flexible circuits allow for narrow lines giving way to high density device population. Denser device populations and lighter conductors can be designed into a product, freeing space for additional product features.

Reliability & Durability

  • The exceptional thermal stability of polyimide allows the circuit to withstand applications with extreme heat, as the materials excellent thermal stability provides a better base for surface mounting than traditional boards. Because the compliant base film places less stress on soldered joints, thermal mismatch is less likely to occur.

Flex Circuit Capabilities

At ETAG, we offer a variety of flex circuit capabilities, including single or double sided circuitry to multilayer technology up to 6 layers.

 Rigid-Flex-RigidFlex-boards-008We also have multiple material substrates and adhesives to choose from, along with a surface finishes and treatments.

Stiffeners can also be added to reinforce selective areas of the flexible circuitry for component support durability and mounting.

 

 

Flex Circuit Capabilities

Below are our flex and rigid flex circuit capabilities, along with available materials substrates and adhesives. We also offer an extensive range of solder mask and coverlay products as well as various surface and finishes treatments.

Capabilities Include

  • Single or Double Sided Circuitry
  • Multilayers, 2 to 6 FPC & Rigid-Flex
  • Lines and Spaces: Single Sided .002", Double Sided .003" - .004"
  • Installation of Connectors, Pins, Contacts, etc.
  • Assembly including SMD
  • Stiffener Supported Areas (using FR-4, Polyamide, Polyester, etc.)
  • Unsupported Fingers
  • Blind & Buried Vias
  • Controlled Impedance
  • Selective Adhesive
  • Shielding, solid or patterned
  • Forming & Creasing
  • Circuits up to 18" x 24"

Materials

Substrates

  • Kapton: Polyimide 1/2 – 5 mils
  • Mylar: Polyester 2 - 5 mils
  • Epoxy
  • Teflon

Copper

  • Half Hard Electro-deposited

Adhesives

  • Modified Acrylic
  • Modified Epoxy
  • Pressure Sensitive (PSA)

Solder Mask / Coverlay

  • Kapton Coverlay 1/2 mil to 5 mils
  • Polyester Coverlay 1 mil to 3 mils
  • Photoimageable Coverlay
  • Soldermask

Surface Treatment & Finishes

  • Hard or Soft Gold
  • Hot Air Level (H.A.L.)
  • Carbon Printing
  • Screen Print Solder Mask
  • Silver

Flex Circuit Benefits

Package Size Reduction

  • Flexible circuit thinness and light weight will enable a substantial packaging size reduction.
  • Flexible circuit's ability to be folded or creased and positioned into the smallest areas makes miniaturization of many devices possible.

Cost Reduction

  • Thin and flexible polyimide film requires a much smaller area, reducing the packaging size and overall material costs.
  • Flex circuits used as interconnects reduce the number of connections to be soldered.

Replacement for Wires & Wire Harness Assemblies

  • Flexible circuits used to replace wiring reduces the errors common in hand wired assemblies.

High Temperature Applications

  • Flex circuits dissipate heat at a better rate than other dielectric materials.
  • Expansion and contraction are minimized when using polyimide material.

Weight Reduction

  • Substantial weight reduction is a benefit over wires and wire harnesses.

High Density Applications

  • Flexible circuits allow for narrow lines giving way to high density device population. Denser device populations and lighter conductors can be designed into a product, freeing space for additional product features.

Reliability & Durability

  • The exceptional thermal stability of polyimide allows the circuit to withstand applications with extreme heat, as the materials excellent thermal stability provides a better base for surface mounting than traditional boards. Because the compliant base film places less stress on soldered joints, thermal mismatch is less likely to occur.

lex Circuit Capabilities

Below are our flex and rigid flex circuit capabilities, along with available materials substrates and adhesives. We also offer an extensive range of solder mask and coverlay products as well as various surface and finishes treatments.

Capabilities Include

  • Single or Double Sided Circuitry
  • Multilayers, 2 to 6 FPC & Rigid-Flex
  • Lines and Spaces: Single Sided .002", Double Sided .003" - .004"
  • Installation of Connectors, Pins, Contacts, etc.
  • Assembly including SMD
  • Stiffener Supported Areas (using FR-4, Polyamide, Polyester, etc.)
  • Unsupported Fingers
  • Blind & Buried Vias
  • Controlled Impedance
  • Selective Adhesive
  • Shielding, solid or patterned
  • Forming & Creasing
  • Circuits up to 18" x 24"

Materials

Substrates

  • Kapton: Polyimide 1/2 – 5 mils
  • Mylar: Polyester 2 - 5 mils
  • Epoxy
  • Teflon

Copper

  • Half Hard Electro-deposited

Adhesives

  • Modified Acrylic
  • Modified Epoxy
  • Pressure Sensitive (PSA)

Solder Mask / Coverlay

  • Kapton Coverlay 1/2 mil to 5 mils
  • Polyester Coverlay 1 mil to 3 mils
  • Photoimageable Coverlay
  • Soldermask

Surface Treatment & Finishes

  • Hard or Soft Gold
  • Hot Air Level (H.A.L.)
  • Carbon Printing
  • Screen Print Solder Mask
  • Silver

Rigid boards

PCB Manufacturing Process Capabilities

Category

Description

Sym.

Capability

1. Microvia Diameter

Rigid-Flex-RigidFlex-boards-009

1.1
Microvia Diameter at Target Land

A

100 um
0.004"

1.2
Microvia Diameter at Capture Land

B

125 um
0.005"

1.3
Microvia Target Land Size

C

0.012"

1.4
Microvia Target Land Size

D

450 um
0.0177"

2. Stagger & Stack

Rigid-Flex-RigidFlex-boards-010

2.1
Min. Staggered Via Pitch Staggered Via Pitch

A

560 um
0.022"

2.2
RCC Thickness
RCC

B

50 um
0.002"

2.3
Blind Via Layers

N

2

3. Material & Construction

Rigid-Flex-RigidFlex-boards-011

3.1
Finished Board Thickness

H

0.012" – 0.250"

3.2
Min. Inner Layer Thickness

H1

0.075 mm
0.003"

3.3
Min. Dielectric Thickness

H2

0.05 mm
0.002"

3.4
Max. Inner Layer Copper

T1

10 oz

3.5
Max. Outer Layer Copper

T2

6 oz

4. Warp

Rigid-Flex-RigidFlex-boards-012

4.1
Warp & Twist (Max.)

A B

< 0.75%

5. Pad

Rigid-Flex-RigidFlex-boards-013

5.1
Min. Finish Hole Size

H

0.005"

5.2
Min. Land Size

H

0.018"

5.3
Min. Annual Ring for Via

R1

IPC Class 2

5.4
Min. Annual Ring for Component

R1

0.05 mm
0.002", provided designed per IPC

6. Drill

Rigid-Flex-RigidFlex-boards-014

 

6.1
Tolerance for PTH Hole

A

0.08 mm
0.003"

6.2
NPTH Hole Tolerance

B

0.05 mm
0.002"

7. Registration for S/M

Rigid-Flex-RigidFlex-boards-014

7.1
Registration for S/M to Pattern

S1-S2

0.0024"

7.2
Registration for Legend to S/M

NA

0.005"

8. Registration for Drill

Rigid-Flex-RigidFlex-boards-016

8.1
Registration for Drill to Inner Layer

S

0.075 mm
0.003"

8.2
Registration for Drill to Datum

S

0.05 mm
0.002"

8.3
Registration for First Drill to Second Drill

NA

0.005"

9. Registration for Layers

 

Rigid-Flex-RigidFlex-boards-017

9.1
Layer to Layer for 4 layers

S

0.08 mm
0.003"

9.2
Layer to Layer for 6 layers

S

0.10 mm
0.004"

9.3
Layer to Layer for 8 layers

S

0.13 mm
0.005"

10. Line Width

Rigid-Flex-RigidFlex-boards-018

10.1
I/L Min. Width (0.5 oz)

W2

0.003"

10.2
O/L Min. Width (0.5 oz)

W1

0.003"

11. Line Space

Rigid-Flex-RigidFlex-boards-019

11.1
I/L Min. Space

S2

0.003"

11.2
O/L Min. Space (0.5 oz)

S

0.003"

12. Drill Capability

Rigid-Flex-RigidFlex-boards-020

12.1
Max. Aspect Ratio
(Board Thickness 0.063")

H/T

12.0

12.2
Min. Drill Hole Size
(Board Thickness 0.063",After Plating)

H

0.0083

 

 

Category

Description

Sym.

Capability

13. S/M Thickness

Rigid-Flex-RigidFlex-boards-021

13.1
Max. Thickness on Copper

H1

0.025 mm
0.001"

13.2
Max. Thickness at Shoulder

H2

0.0075 mm
0.0003"

14. S/M Capability

Rigid-Flex-RigidFlex-boards-022

14.1
Min. SMD Space for Dam

W2

0.0078"

14.2
Min. Dam Size

W1

0.0003"

15. Carbon Capability

Rigid-Flex-RigidFlex-boards-023

15.1
Max. Contact Resistance

NA

30 O / sq

15.2
Max. Primary Resistance

NA

30 O

15.3
Min. Thickness

NA

0.0004"

15.4
Min. Space

A

0.015"

15.5
Max. Space for Registration

B

0.007"

16. HAL Capability

Rigid-Flex-RigidFlex-boards-024

16.1
Board Thickness for HAL

H2

0.6 mm
0.0236"

16.2
Min. Pad Width/Space fo HAL

W

0.25 mm
0.0098"

16.3
HAL Thickness for any point

H1

0.001 mm ~
0.025 mm
40micro-inch ~0.001"

16.4
Thickness on QFP Pad
(0.05" Wide Quad)

A

0.015 mm ~
0.030 mm
0.0006"~0.0012"

17. HAL Capability

Rigid-Flex-RigidFlex-boards-025

17.1
Outline Tolerance-Punching

AB

NA

17.2
Outline Tolerance-Routing

AB

0.005"

18. Beveling Capability

Rigid-Flex-RigidFlex-boards-026

18.1
Beveling Angle

B

200-600

18.2
Tolerance for Outline of Bevel

A

+ - 0.005"

19. V-Cut Capability

Rigid-Flex-RigidFlex-boards-027

19.1
V-Cut Angle V-Cut

C

300

19.2
Range of Board Thickness

H

0.010"~0.125"

19.3
Tolerance of V-Cut Residual

B

0.05 mm
0.002"

19.4
V-Cut Off Line V-Cut

D

0.125 mm
0.005"

20. Test Capability

Rigid-Flex-RigidFlex-boards-028

20.1
Voltage

NA

5 –500 VDC

20.2
Isolation

NA

500 MO

20.3
Continuity

NA

20O~100KO

20.4
Min. SMD PAD Pitch SMD

P

0.3 mm
0.0118"

21. Impedance Control Capability

Rigid-Flex-RigidFlex-boards-029

21.1
Impedance Control > 50O

NA

+/- 10%

21.2
Impedance Control < 50O

NA

+/- 10%

22. Differential Impedance Capability

Rigid-Flex-RigidFlex-boards-030

22.1
Differential Impedance Control > 50O

NA

+/- 10%

22.2
Differential Impedance Control < 50O

NA

+/- 10%

23. Coplanar Impedance Capability

Rigid-Flex-RigidFlex-boards-030

22.1
Coplanar Impedance Control > 50O

NA

+/- 10%

22.2
Coplanar Impedance Control < 50O

NA

+/- 10%

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Design by: Electronic Trade of Arsh Gostar Co. (ETAG) Multimedia Studio :: amir abdi :: 2016